Samsung reconsiders TSMC partnership amid HBM market challenges

Samsung Electronics may partner with rival TSMC for base die manufacturing on its next-gen HBM4 memory chips, marking a departure from Samsung's usual "vertical integration" strategy, as reported by the Korea Herald. As Samsung contends with slower-than-expected earnings and strong competition from fellow chaebol SK Hynix, a strategic collaboration with TSMC could enhance Samsung's position in the AI-driven HBM sector. While no final decision has been made, experts suggest this shift may help Samsung regain ground in high-value memory markets dominated by TSMC.